Flotgen, C.: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Wafer bonding using Cu–Sn intermetallic bonding layers

Flötgen, C., Pawlak, M., Pabo, E., Wiel, H. J., Hayes, G. R., Dragoi, V.

Journal:

Microsystem Technologies

Year:

2014

Language:

english

File:

PDF, 676 KB

english, 2014

2

Etching of Bacillus atrophaeus by oxygen atoms, molecules and argon ions

Benedikt, J, Flötgen, C, Kussel, G, Raball, V, Keudell, A von

Journal:

Journal of Physics Conference Series

Year:

2008

Language:

english

File:

PDF, 500 KB

english, 2008

3

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room temperature fabrication of semiconductor interfaces

Razek, N., Flotgen, C., Dragoi, V., Wimplinger, M.

Year:

2017

Language:

english

File:

PDF, 641 KB

english, 2017

4

Inactivation of Bacteria and Biomolecules by Low-Pressure Plasma Discharges

A. von Keudell, P. Awakowicz, J. Benedikt, V. Raballand, A. Yanguas-Gil, J. Opretzka, C. Flötgen, R. Reuter, L. Byelykh, H. Halfmann, K. Stapelmann, B. Denis, J. Wunderlich, P. Muranyi, F. Rossi, O. K

Journal:

Plasma Processes and Polymers

Year:

2010

Language:

english

File:

PDF, 1.29 MB

english, 2010

5

Calibration of a miniaturized retarding field analyzer for low-temperature plasmas: geometrical transparency and collisional effects

Baloniak, Tim, Reuter, Rüdiger, Flötgen, Christoph, von Keudell, Achim

Journal:

Journal of Physics D Applied Physics

Year:

2010

Language:

english

File:

PDF, 596 KB

english, 2010

6

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Wafer bonding for CMOS integration and packaging

Dragoi, V., Kurz, F., Wagenleitner, T., Flotgen, C., Mittendorfer, G.

Year:

2012

Language:

english

File:

PDF, 1.84 MB

english, 2012

7

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Metal wafer bonding for 3D interconnects and advanced packaging

Dragoi, V., Pabo, E., Wagenleitner, T., Flotgen, C., Rebhan, B., Corn, K.

Year:

2012

Language:

english

File:

PDF, 1.69 MB

english, 2012

8

Design, synthesis and 3D-QSAR studies of novel 1,4-dihydropyridines as TGFβ/Smad inhibitors

Längle, Daniel, Marquardt, Viktoria, Heider, Elena, Vigante, Brigita, Duburs, Gunars, Luntena, Iveta, Flötgen, Dirk, Golz, Christopher, Strohmann, Carsten, Koch, Oliver, Schade, Dennis

Journal:

European Journal of Medicinal Chemistry

Year:

2015

Language:

english

File:

PDF, 3.04 MB

english, 2015

9

Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication

Flotgen, C., Razek, N., Dragoi, V., Wimplinger, M.

Journal:

ECS Transactions

Year:

2014

Language:

english

File:

PDF, 1.01 MB

english, 2014

10

SPIE Proceedings [SPIE SPIE Microtechnologies - Grenoble, France (Wednesday 24 April 2013)] Smart Sensors, Actuators, and MEMS VI - Cu-Sn transient liquid phase wafer bonding for MEMS applications

Flötgen, C., Pawlak, M., Pabo, E., van de Wiel, H. J., Hayes, G. R., Dragoi, V., Schmid, Ulrich, Sánchez de Rojas Aldavero, José Luis, Leester-Schaedel, Monika

Year:

2013

Language:

english

File:

PDF, 796 KB

english, 2013

11

[IEEE 2011 International Semiconductor Conference (CAS 2011) - Sinaia, Romania (2011.10.17-2011.10.19)] CAS 2011 Proceedings (2011 International Semiconductor Conference) - CMOS-compatible aligned fusion wafer bonding

Dragoi, V., Mittendorfer, G., Flotgen, C., Dussault, D., Wagenleitner, T.

Year:

2011

Language:

english

File:

PDF, 727 KB

english, 2011

12

[IEEE 2013 International Semiconductor Conference (CAS 2013) - Sinaia, Romania (2013.10.14-2013.10.16)] CAS 2013 (International Semiconductor Conference) - Wafer bonding for vacuum encapsulated MEMS

Dragoi, V., Pawlak, M., Flotgen, C., Mittendorfer, G., Pabo, E.

Year:

2013

Language:

english

File:

PDF, 805 KB

english, 2013

13

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Heterogeneous integration through direct wafer bonding

Eibelhuber, M., Razek, N., Dragoi, V., Flotgen, C., Wimplinger, M., Uhrmann, T.

Year:

2015

Language:

english

File:

PDF, 337 KB

english, 2015

14

Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g

Cariou, Romain, Benick, Jan, Beutel, Paul, Razek, Nasser, Flotgen, Christoph, Hermle, Martin, Lackner, David, Glunz, Stefan W., Bett, Andreas W., Wimplinger, Markus, Dimroth, Frank

Journal:

IEEE Journal of Photovoltaics

Year:

2017

Language:

english

File:

PDF, 769 KB

english, 2017

15

Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding

Flotgen, C., Razek, N., Dragoi, V., Wimplinger, M.

Journal:

ECS Transactions

Year:

2016

Language:

english

File:

PDF, 556 KB

english, 2016

16

Surface pretreated low-temperature aluminum–aluminum wafer bonding

Hinterreiter, Andreas P., Rebhan, Bernhard, Flötgen, Christoph, Dragoi, Viorel, Hingerl, Kurt

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 2.01 MB

english, 2017

17

Characterization of Wafer-Bonded Oxide-Free Silicon with Surfaces Treated with an Ion-Bombardment Procedure

Liao, Michael, Li, Chao, Flötgen, Christoph, Goorsky, Mark S.

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 298 KB

english, 2018

18

[IEEE 2019 European Space Power Conference (ESPC) - Juan-les-Pins, France (2019.9.30-2019.10.4)] 2019 European Space Power Conference (ESPC) - Radiation hard four-junction space solar cell based on GaInAsP alloys

Lackner, David, Schwar, Joerg, Dimroth, Frank, Schon, Jonas, Lang, Robin, Godejohann, Birte-Julia, Predan, Felix, Schachtner, Michael, Boizot, Bruno, Lefevre, Jereemie, Flotgen, Christoph

Year:

2019

Language:

english

File:

PDF, 327 KB

english, 2019